multilayer ceramic chip capacitors 1 of 3 creation date : june 26, 2017 (gmt) cga3e3x5r1h474k080ab tdk item description cga3e3x5r1h474kt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga3(1608) [eia 0603] status production size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 470nf 10% rated voltage 50vdc temperature characteristic x5r(15%) dissipation factor (max.) 5% insulation resistance (min.) 1063m other soldering method wave (flow) re?ow aec-q200 yes packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 26, 2017 (gmt) cga3e3x5r1h474k080ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga3e3x5r1h474k080ab esr cga3e3x5r1h474k080ab capacitance cga3e3x5r1h474k080ab dc bias characteristic cga3e3x5r1h474k080ab temperature characteristic cga3e3x5r1h474k080ab(no bias) cga3e3x5r1h474k080ab(dc bias = 25v ) ripple temperature rising cga3e3x5r1h474k080ab(100khz) cga3e3x5r1h474k080ab(500khz) cga3e3x5r1h474k080ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 26, 2017 (gmt) cga3e3x5r1h474k080ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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